The Thermal Engineering disciplines applied to the design of electronic equipment concern themselves with the heat generation and transmission within the equipment and across the equipment boundary. The most common problem in today's electronics is to cool the equipment so the electronic components operate within their specified maximum temperature limits. The deliberate heating is also of interest, for example, in case of outdoors equipment to operate in cold climates.

It has become evident in the electronics industry, particularly in the last five years or so, the need of careful consideration of the thermal issues associated with electronic design. The origin of this trend lies on the miniaturization and the very fundaments of Physics. Advances in component miniaturization put more and more functionality in the same volume of electronics. While the volume necessary for a given electronic function goes down as the third power of the linear dimensions, the capacity for dissipating the heat generated goes down only by the second power (area) of the device. The actual Physics of the electronic devices in question prevent the heat (power) generated as a byproduct of their operation to decrease as the physical area goes down. The inevitable effect is that the devices’ temperature goes up, more hot spots appear on the Printed Circuit Board, thus resulting in the need for a more efficient cooling mechanism.

Whatever the thermal problem, ComSysDes Team works closely with the client to understand and fulfill its needs. With our background covering also most of the other disciplines that conform the design of electronic systems, we understand that the thermal design should not be customer's primary concern. We pride ourselves in helping the customer to define the thermal problem and quickly produce usable results.

Do not hesitate to ask for the specifics of your thermal design needs. Please e-mail a brief description of your problem to or call (510) 792-1760 for assistance.